▌Regulated surface reactant coverage for efficient electrochemical oxidation of 5-hydroxymethylfurfural and coupled hydrogen evolution
調控表面反應物覆蓋度以實現高效 5-羥甲基糠醛電化學氧化並耦合產氫
Dessalew Dagnew Alemayehu, Chia-Yu Chang, Chun-Chi Chang, Keseven Lakshmanan, Wei-Sheng Liao, Endalkachew Asefa Moges, Chueh-Cheng Yang, Woldesenbet Bafe Dilebo, Tsung-I. Yeh, Meng-Che Tsai*, Wei-Nien Su*, Chia-Hsin Wang* and Bing Joe Hwang*
https://doi.org/10.1016/j.apcatb.2026.127218
SEED Member: Bing Joe Hwang, Wei-Nien Su, Meng-Che Tsai, Endalkachew Asefa Moges
Major Contributions
1. Engineered a Cu₃N-CuO/CF heterointerface catalyst by decorating Cu₃N nanoclusters on CuO nanowires; under anodic operation, Cu₃N reconstructs in situ into an oxygen-vacancy-rich CuO (rCuO-Ov) overlayer.
2. The dual-site architecture balances reactant coverage: HMF adsorbs preferentially on CuO while rCuO-Ov sites favor OH⁻, as validated by in situ ATR-FTIR and DFT calculations.
3. The catalyst reaches 500 mA cm⁻² at ~1.48 V with nearly 99% FDCA yield and Faradaic efficiency over repeated cycles; coupled electrolysis in an AEM electrolyzer saves ~1.05 kWh per m³ H₂ versus water electrolysis.
主要貢獻
1. 將 Cu₃N 奈米團簇修飾於 CuO 奈米線上，製備 Cu₃N-CuO/CF 異質界面觸媒；在陽極操作下，Cu₃N 原位重構為富含氧空位的 CuO（rCuO-Ov）表層。
2. 雙位點結構平衡反應物覆蓋度：HMF 優先吸附於 CuO，rCuO-Ov 位點則偏好吸附 OH⁻，臨場 ATR-FTIR 與 DFT 計算證實此吸附行為。
3. 觸媒在約 1.48 V 達到 500 mA cm⁻²，重複循環中 FDCA 產率與法拉第效率接近 99%；於陰離子交換膜電解槽耦合電解，每立方公尺氫氣比傳統電解水省約 1.05 kWh。
